Upsite Technologies is Featured in Thermal News’ February Newsletter

Upsite Technologies is Featured in Thermal News’ February Newsletter

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Upsite Tech’s recently enhanced AisleLok Under Rack Panel is featured in Thermal News’ February Newsletter.

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FEBRUARY 2016

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space FAQ’s About Temperature Control and Sensor Selection

Thermalogic Corp.

Do I need PID or ON/OFF control? Usually, if your system moves heat quickly (less than a few seconds delay from changing heater power to observing a change in temperature at the load) from the heat source into the area under control or the amount of heat available matches or exceeds dissipation by less than a factor of about 2, then ON/OFF control will give consistently better performance. That is, ON/OFF control will produce less overshoot, smaller deviations from setpoint, and faster warm-up than a PID control without extensive tuning.

 

Click Here to Read the Full Article

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Sponsored Announcement
space Advancements in Thermal Management 2016 Call for Papers Deadline Feb. 18th

Join other industry visionaries and speak at theAdvancements in Thermal Management Conference. This event provides a technical forum to discuss developments in technology, market conditions and end-user requirements that are driving innovation, capabilities and features, application trends and performance improvements in the temperature management industry.

 

Here are Some of the Topics we are Looking for:

  • Upcoming and Emerging Technologies for Thermal Management
  • Market Opportunities for Thermal Products and Services
  • Advanced Thermal Materials
  • Thermal Modeling/Infrared/Thermography
  • Cooling Technology (including Air, Liquid and Vibration Cooling)
  • Thermal Ground Planes
  • LED Cooling
  • IC Level Thermal Management
  • R&D in Thermal Management Related Spaces
  • Thermal Sensing and Measurement (Sensors, Instruments, & Test Equipment)
  • Thermal Control
  • Heating Electronics in Cold Environments

Full-conference registration fees will be waived for all confirmed speakers.

Please note, the deadline to submit an abstract is February 18th, 2016. Send abstracts to Nick Depperschmidt, program manager, at 720-528-3770, ext. 111 or NickD@WebcomCommunications.com.

 

Visit our call for papes page to learn more.

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New Products
Malico Inc. Liquid Cold Plates

Liquid cold plate is one of the most common liquid cooling solutions.   Air cool solution has performance limit of ~0.1 C/W while liquid cooling solution can reach performance limit of one magnitude lower, ~0.01 C/W (typically around 0.03C/W – 0.06 C/W)!

 

Malico works with customers to design and manufacture cold plates that meet their specific application and budget.    Our proprietary brazing process allows us to offer light weight aluminum cold plates cost effectively.  When higher performance is required, we would suggest aluminum-copper or copper-copper cold plates.

 

Our high-end pin-fin embedded water block cold plates outperform our competitor’s.  The water block fin structure is formed one-piece, so there is no contact resistance between base and fins.  Heat from heat source is transferred to fins and carried away by liquid effectively.  It can be customize easily in size and height for different applications.  Our unique dual-water channel design helps our customer not only to reduce cost but also save precious space in the system.

Malico understands quality is key for liquid cooling.  Each of our cold plate goes through many leak and pressure testing during manufacturing processes.   Before mass production, we will test the cold plates with rigorous thermal shock and temperature cycles to assure long term reliability of our brazing quality.

 

With every manufacturing process done in-house, Malico has best control of quality and lead time.  Our vertical integrated lines allow us to support both low and high volume productions.

 

Learn more at: www.malico.com/ad_cp/


Thermalogic TempGuard Analog Temperature Controls

Thermalogic’s line of TempGuard analog temperature controls are ideal for those looking for a cost effective solution for highly accurate electronic controls.  Our TempGuard Series meets both RoHs and REACH standards, making them a perfect replacement for mechanical controls that may not meet these standards in addition to the superior accuracy of electronic controls.
For 45 years, Thermalogic has been manufacturing controls for OEM and Volume Users so you can be confident that you are using proven and reliable designs. Our built to order philosophy allows users to get a control configured to their exact requirements and specifications.

A wide variety of input, output and packaging options are available to fit virtually any application where accurate and reliable control are needed at a reasonable cost.   Our factory direct model insures that you only deal with knowledgeable Sales Engineers who understand our capabilities inside and out.

 

Learn More at: www.thermalogic.com


New MicroCool 3000 Series Cold Plates

The MicroCool 3000 series cold plates have been introduced. The aluminum cold plates are made specifically for power electronics cooling and have balanced parallel cooling to ensure uniform temperatures and low pressure drop. – Read More

 

New PWM Temperature Controller for Liquid Chiller

TECA Corporation’s TLC-900 Bench Top Liquid Chiller has been upgraded with a Pulse Width Modulating (PWM) controller incorporating four PID temperature ranges for improved temperature control over a wide temperature range.  USB communications, operational and data logging software are standard.  – Read More

 

Laird’s Temperature Control System Optimizes Performance of Outdoor Enclosures

Laird has developed a smaller, more efficient option to cool or heat vital electronics used in outdoor kiosks and enclosures including telecom, battery backup, industrial and other cabinets. The AA-230 series air-to-air thermoelectric assembly (TEA) offers lower cost of ownership by maintaining the appropriate temperature range using less energy than standard air-to-air systems. – Read More

 

Upsite Technologies Enhances AisleLok Under Rack Panel

Upsite Technologies, Inc. has made enhancements to the AisleLok Under Rack Panel. Computational Fluid Dynamics (CFD) analysis recently revealed that the Under Rack Panel reduced intake temperatures as a result of eliminating exhaust air recirculation under the rack; up to $50,000 in annual energy savings for a 20,000 square foot data center. – Read More

Industry News
Siemens to Acquire Simulation Software Supplier CD-adapco

Siemens and CD-adapco have entered into a stock purchase agreement for the acquisition of CD-adapco by Siemens. The purchase price is $970 million. CD-adapco is a global engineering simulation company with software solutions covering a wide range of engineering disciplines including Fluid Dynamics (CFD), Solid Mechanics (CSM), heat transfer, particle dynamics, reactant flow, electrochemistry, acoustics and rheology. – Read More

 

North American Data Centers Save Over 1 Billion Gallons of Water Using Emerson Network Power Cooling System

Emerson Network Power has announced that the deployment of the Liebert DSE pumped refrigerant economization system in North America has saved over 1.4 billion gallons of water in the last 36 months, compared to using data center chilled water cooling systems, and is expected to save an additional 1 billion gallons of water in 2016. – Read More

 

Thermacore Europe Wins Prestigious Manufacturing Award

Thermacore, Inc. announced that Thermacore Europe (www.thermacore-europe.com/) is the winner of a silver EEF/Aldermore Future Manufacturing Award. Based in Ashington, United Kingdom, Thermacore Europe was runner-up for the Business Efficiency Award. – Read More

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Event Listings

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space IoT North America Final Program Announced
The Internet of Things North America conference has announced its conference program. The brightest minds from companies such as Google, Intel, Oracle, IBM, Schneider Electric, NXP, Honeywell and Parker-Hannifan will provide technical and practical insight on the future of the connected world. Sign up to attend at our early bird rate and learn about important industry trends, the IoT value chain and the overall Internet of Things ecosystem and markets.Visit the conference program page to view more


logoOEM Lighting & Display 2016 | Call for Presentation Deadline is February 18th
OEM Lighting & Display 2016, taking place August 3-4, 2016 in Denver, Colo., is currently accepting presentation abstracts. The conference is focused on the latest advancements in lighting and display technology for OEM design engineers. Conference Sessions should be technical and educational while providing examples of recent installations, cutting-edge technology and application strategies from users driving grown in these markets.

 

Call for Presentations Deadline February 18th | Click Here for More Info

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Read the full newsletter at ThermalNews.com